Metal plating compositions

US8048284B2 · kind B2 · utility

Assignee

• Rohm and Haas Electronic Materials LLC · US

Inventors

• Erik Reddington · Ashland, US
• Gonzalo Urrutia Desmaison · Berlin, DE
• Zukhra I. Niazimbetova · Westborough, US
• Donald E. Cleary · Littleton, US
• Mark Lefebvre · Hudson, US

Key dates

• Filing date: Apr 2, 2008
• Grant date: Nov 1, 2011
• Expiry date: Jul 25, 2030

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K3/423
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate.