Superior fill conditions in a replacement gate approach by corner rounding prior to completely removing a placeholder material
US8048792B2 · kind B2 · utility
11Cited by
2References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2010 |
| Grant date | Nov 1, 2011 |
| Priority date | — |
| Expiry date | Sep 29, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/691
Abstract
In a replacement gate approach, a superior cross-sectional shape of the gate opening may be achieved by performing a material erosion process in an intermediate state of removing the placeholder material. Consequently, the remaining portion of the placeholder material may efficiently protect the underlying sensitive materials, such as a high-k dielectric material, when performing the corner rounding process sequence.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.