Patent · US Active

Heat spreader for semiconductor package

US8049313B2 · kind B2 · utility

5Cited by

5References

7Claims

0Family size

Assignee

Freeescale Semiconductor, Inc. · US

Inventors

Chee Seng Foong · Bandar Baru Sungai Buloh, MY
Kim Chiew Ho · Batu Caves, MY

Key dates

Filing date	Sep 20, 2006
Grant date	Nov 1, 2011
Priority date	—
Expiry date	Nov 29, 2026

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/1433
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A heat spreader (50) for a semiconductor package (100) includes a heat dissipating portion (52) having a recessed periphery (54). A thermosetting resin (58) is disposed in the recessed periphery (54). The heat spreader (50) may include a heat absorbing portion (56) coupled to the heat dissipating portion (52).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.