Semiconductor device with reduced sensitivity to package stress
US8056415B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 30, 2008 |
| Grant date | Nov 15, 2011 |
| Priority date | — |
| Expiry date | Jul 15, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P2015/082
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A microelectromechanical systems (MEMS) sensor (52) includes a substrate (62) a movable element (58) spaced apart from the substrate (62), suspension anchors (66, 68, 70, 72) formed on the substrate (62), and compliant members (74) interconnecting the movable element (58) with the suspension anchors. The MEMS sensor (52) further includes fixed fingers (76) and fixed finger anchors (78) attaching the fixed fingers (76) to the substrate (62). The movable element (58) includes openings (64). At least one of the suspension anchors resides in at least one of the multiple openings (64) and pairs (94) of the fixed fingers (76) reside in other multiple openings (64). The MEMS sensor (52) is symmetrically formed, and a location of the fixed finger anchors (78) defines an anchor region (103) within which the suspension anchors (66, 68, 70, 72) are positioned.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.