Circuit board surface structure
US8058564B2 · kind B2 · utility
1Cited by
1References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 6, 2008 |
| Grant date | Nov 15, 2011 |
| Priority date | — |
| Expiry date | Sep 1, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0594
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board surface structure includes a circuit board having at least one surface provided with a plurality of electrically connecting pads, an insulating protective layer characterized by photosensitivity and solder resisting and formed on the circuit board, and a plurality of openings formed in the insulating protective layer to expose the electrical connecting pads on the circuit board and tapered upward; and a conductive element formed in the opening, so as to increase the contact area and reinforce bonding between the electrically connecting pads and the conductive element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.