Configuration of a multi-die integrated circuit
US8058897B1 · kind B1 · utility
17Cited by
1References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2010 |
| Grant date | Nov 15, 2011 |
| Priority date | — |
| Expiry date | Jun 28, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A method of configuring an integrated circuit (IC) can include receiving configuration data within a master die of the IC. The IC can include the master die and a slave die. A master segment and a slave segment of the configuration data can be determined. The slave segment of the configuration data can be distributed to the slave die of the IC.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.