Patent · US Active

Package level ESD protection and method therefor

US8059380B2 · kind B2 · utility

0Cited by

6References

4Claims

0Family size

Assignee

Freeescale Semiconductor, Inc. · US

Inventors

Sergio A. Ajuria · Austin, US
Melanie Etherton · Austin, US
Marc Alan Mangrum · Austin, US

Key dates

Filing date	May 15, 2008
Grant date	Nov 15, 2011
Priority date	—
Expiry date	May 5, 2029

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor package includes an electrostatic discharge rail capable of being coupled to a first conductive contact and a second conductive contact, a first portion of a voltage triggerable material between the electrostatic discharge rail and the first conductive contact; and a second portion of the voltage triggerable material between the electrostatic discharge rail and the second conductive contact. The first and second conductive contacts may be coupled to the same semiconductor device or different semiconductor devices.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.