Testing fuse configurations in semiconductor devices
US8063650B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 10, 2008 |
| Grant date | Nov 22, 2011 |
| Priority date | — |
| Expiry date | Nov 4, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48145
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Methods, systems, and apparatus for testing semiconductor devices. A semiconductor device includes one or more external terminals configured to receive fuse configuration data from an external source. The semiconductor device also includes a soft-blow circuit to generate a soft-blow signal based on the fuse configuration data, and a fuse circuit that includes a fuse and has first and second operational states corresponding to the fuse being intact and blown, respectively. The fuse circuit is configured to receive the soft-blow signal and to select its operational state to be the first or second operational state based on the received soft-blow signal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.