Semiconductor chip package and printed circuit board
US8064215B2 · kind B2 · utility
6Cited by
3References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 5, 2008 |
| Grant date | Nov 22, 2011 |
| Priority date | — |
| Expiry date | Oct 14, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10674
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip package and a printed circuit board having an embedded semiconductor chip package are disclosed. The semiconductor chip package may include a semiconductor chip that has at least one chip pad formed on one side, and a capacitor formed on the other side of the semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.