Localized substrate geometry characterization
US8065109B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 28, 2009 |
| Grant date | Nov 22, 2011 |
| Priority date | — |
| Expiry date | Aug 28, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/12
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system for evaluating the metrological characteristics of a surface of a substrate, the system including an optical substrate measurement system, a data analyzing system for analyzing data in an evaluation area on the substrate, applying feature-specific filters to characterize the surface of the substrate, and produce surface-specific metrics for characterizing and quantifying a feature of interest, the surface-specific metrics including a range metric for quantifying maximum and minimum deviations in the evaluation area, a deviation metric for quantifying a point deviation having a largest magnitude in a set of point deviations, where the point deviations are an amount of deviation from a reference plane fit to the evaluation area, and a root mean square metric calculated from power spectral density.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.