Patent · US Active

Method of iterative compensation for non-linear effects in three-dimensional exposure of resist

US8067134B2 · kind B2 · utility

1Cited by
10References
23Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 22, 2009
Grant dateNov 29, 2011
Priority date
Expiry dateOct 22, 2029

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S430/146
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

The field of this disclosure is making three-dimensional topographic structures by means of graduated exposure in a photosensitive material, such as a photoresist, photosensitive polymide, or similar. Such patterns may be written either to be used directly as optical, mechanical, fluidic, etc. components, e.g. diffusors, non-reflecting surfaces, Fresnel lenses and Fresnel prisms, computer-generated holograms, lenslet arrays, etc, or to be used as masters for the fabrication of such components by replication. Replication can be done by molding, pressing, embossing, electroplating, etching, as known in the art. This disclosure includes descriptions of using passive absorbing components in thin resist, using high gamma thick resists with high resolution pattern generators, using multiple focal planes including at least one focal plane in the bottom half of the resist, and iterative simulation of patterning and adjustment of an exposure map.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.