Integrated circuit package system with package integration
US8067275B2 · kind B2 · utility
0Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2007 |
| Grant date | Nov 29, 2011 |
| Priority date | — |
| Expiry date | Sep 2, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package system comprising: providing a base substrate; attaching a base integrated circuit die over the base substrate; forming a support over the base substrate near only one edge of the base substrate; and attaching a stack substrate over the support and the base integrated circuit die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.