Integrated circuit package system with planar interconnects
US8067831B2 · kind B2 · utility
4Cited by
17References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 16, 2005 |
| Grant date | Nov 29, 2011 |
| Priority date | — |
| Expiry date | Dec 1, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15331
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package system is provided including forming a first substrate, mounting a first integrated circuit to the first substrate, and forming first planar interconnects in contact with the first integrated circuit and electrically connecting the first integrated circuit to the first substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.