Microelectromechanical system package
US8072081B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 4, 2008 |
| Grant date | Dec 6, 2011 |
| Priority date | — |
| Expiry date | Mar 12, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A microelectromechanical system package includes a chip carrier, a first microelectromechanical system chip, a silicon cover, a layer of metal, a plurality of first bonding wires and a sealant. The first microelectromechanical system chip is positioned on the chip carrier and has an active surface, and an active area on the active surface. The layer of metal is formed on the upper surface of the cover. The first bonding wires electrically connect the active surface of the first microelectromechanical system chip to the chip carrier. The sealant is formed on the chip carrier to encapsulate the first microelectromechanical system chip and the first bonding wires.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.