Semiconductor device with plastic package molding compound, semiconductor chip and leadframe and method for producing the same

US8072085B2 · kind B2 · utility

Assignee

• Qimonda AG · DE

Inventors

• Wolfgang Hetzel · Nattheim, DE
• Jochen Thomas · Munich, DE

Key dates

• Filing date: Oct 25, 2004
• Grant date: Dec 6, 2011
• Expiry date: Apr 25, 2027

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/15311
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A semiconductor device with a plastic package molding compound, a semiconductor chip and a leadframe is disclosed. In one embodiment, the semiconductor chip is embedded in a plastic package molding compound. The upper side of the semiconductor chip and the plastic package molding compound are arranged on a leadframe. Arranged between the leadframe and the plastic package molding compound with the semiconductor chip is an elastic adhesive layer for the mechanical decoupling of an upper region from a lower region of the semiconductor device.