Wolfgang Hetzel
12Patents
6h-index
26Co-inventors
66Inventor score
Filing activity: Jan 9, 1998 → Aug 27, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6894381B2 | Electronic device having a stack of semiconductor chips and method for the production thereof | Electricity | 57 | Expired |
| US6927484B2 | Stack arrangement of a memory module | Electricity | 15 | Expired |
| US7402911B2 | Multi-chip device and method for producing a multi-chip device | Electricity | 13 | Expired |
| US6075358A | Device in a semiconductor manufacturing installation in particular for integrated circuits | Electricity | 12 | Expired |
| US7198979B2 | Method for manufacturing a stack arrangement of a memory module | Electricity | 7 | Expired |
| US7265441B2 | Stackable single package and stacked multi-chip assembly | Electricity | 7 | Expired |
| US7851899B2 | Multi-chip ball grid array package and method of manufacture | Electricity | 6 | Expired |
| US8624372B2 | Semiconductor component comprising an interposer substrate | Electricity | 5 | Active |
| US6977427B2 | Electronic component having stacked semiconductor chips in parallel, and a method for producing the component | Electricity | 5 | Expired |
| US8072085B2 | Semiconductor device with plastic package molding compound, semiconductor chip and leadframe and method for producing the same | Electricity | 1 | Active |
| US8592258B2 | Semiconductor package and method of attaching semiconductor dies to substrates | Electricity | 0 | Active |
| US11469161B2 | Lead frame-based semiconductor package | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.