Lithography systems and processes
US8072577B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 5, 2006 |
| Grant date | Dec 6, 2011 |
| Priority date | — |
| Expiry date | Apr 7, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/2014
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An exemplary lithography process may include: receiving a substrate having a photo-sensitive layer; providing a light source capable of causing an exposure of a portion of the photo-sensitive layer; and providing a mask capable of defining at least one pattern that is to be transferred to the photo-sensitive layer. Specifically, the substrate has a top surface on or over the photo-sensitive layer, and the mask receives an electromagnetic wave from the light source at a first surface of the mask and generates a plurality of electromagnetic components from a second surface of the mask. The lithography process may also include: providing a lens, which provides a flat surface at a bottom surface of the lens, for transferring the pattern to the photo-sensitive layer; and adjusting the distance between the flat surface of the lens and the top surface of the substrate to control the number and amount of the electro-magnetic components projected onto the photo-sensitive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.