Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity over the post
US8076182B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2010 |
| Grant date | Dec 13, 2011 |
| Priority date | — |
| Expiry date | Jul 31, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8506
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a substrate on the adhesive including aligning the post with an aperture in the substrate, then flowing the adhesive into and upward in a gap located in the aperture between the post and the substrate, solidifying the adhesive, then etching the post to form a cavity in the adhesive above the post, then mounting a semiconductor device on the post, wherein a heat spreader includes the post and the base and the semiconductor device extends into the cavity, electrically connecting the semiconductor device to the substrate and thermally connecting the semiconductor device to the heat spreader.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.