Method of attaching an interconnection plate to a semiconductor die within a leadframe package
US8076183B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 27, 2009 |
| Grant date | Dec 13, 2011 |
| Priority date | — |
| Expiry date | Dec 31, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method is disclosed for attaching an interconnection plate to semiconductor die within leadframe package. A base leadframe is provided with die pad for attaching semiconductor die. An interconnection plate is provided for attachment to the base leadframe and semiconductor die. Add a base registration feature onto base leadframe and a plate registration feature onto interconnection plate with the registration features designed to match each other such that, upon approach of the interconnection plate to base leadframe, the two registration features would engage and guide each other causing concomitant self-aligned attachment of the interconnection plate to base leadframe. Next, the interconnection plate is brought into close approach to base leadframe to engage and lock plate registration feature to base registration feature hence completing attachment of the interconnection plate to semiconductor die and forming a leadframe package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.