Electronic device and method for production
US8076238B2 · kind B2 · utility
7Cited by
7References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 21, 2007 |
| Grant date | Dec 13, 2011 |
| Priority date | — |
| Expiry date | Nov 28, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/2076
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device and method for production is disclosed. One embodiment provides an integrated component having a first layer which is composed of copper or a copper alloy or which contains copper or a copper alloy, and having an electrically conductive second layer, whose material differs from the material of the first layer, and a connection apparatus which is arranged on the first layer and on the second layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.