Method and system for monitoring contamination on a substrate
US8083862B2 · kind B2 · utility
1Cited by
9References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 9, 2007 |
| Grant date | Dec 27, 2011 |
| Priority date | — |
| Expiry date | Jan 27, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/906
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and system for measuring contamination, such as metal contamination, on a substrate. A dry cleaning system is utilized for non-destructive, occasional removal of contamination, such as metal containing contamination, on a substrate, whereby a monitoring system coupled to the exhaust of the dry cleaning system is employed to determine the relative level of contamination on the substrate prior to dry cleaning.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.