Patent · US Active

Method of implementing a capacitor in an integrated circuit

US8084297B1 · kind B1 · utility

4Cited by
8References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 5, 2010
Grant dateDec 27, 2011
Priority date—
Expiry dateAug 5, 2030

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/3011
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A method of implementing a capacitor in an integrated circuit package is disclosed. The method comprises coupling the capacitor to a first surface of a substrate of the integrated circuit package; positioning an integrated circuit die over the capacitor, wherein the integrated circuit die has a first plurality of solder bumps and a second plurality of solder bumps separated by a region having no solder bumps; coupling the integrated circuit die to the first surface of the substrate over the capacitor, wherein the region having no solder bumps is positioned over the capacitor; and encapsulating the integrated circuit die and the capacitor.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.