Hot edge ring with sloped upper surface
US8084375B2 · kind B2 · utility
8Cited by
6References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 2, 2010 |
| Grant date | Dec 27, 2011 |
| Priority date | — |
| Expiry date | Nov 2, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/2001
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A hot edge ring with extended lifetime comprises an annular body having a sloped upper surface. The hot edge ring includes a step underlying an outer edge of a semiconductor substrate supported in a plasma processing chamber wherein plasma is used to process the substrate. The step includes a vertical surface which surrounds the outer edge of the substrate and the sloped upper surface extends upwardly and outwardly from the upper periphery of the vertical surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.