Multivariate monitoring method for plasma process machine
US8085390B2 · kind B2 · utility
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4References
9Claims
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Key dates
| Filing date | Apr 19, 2007 |
| Grant date | Dec 27, 2011 |
| Priority date | — |
| Expiry date | Feb 12, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32972
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An advance process control (APC) system for a plasma process machine is provided, which includes at least an optical emission spectroscopy (OES) system and an APC analysis apparatus. The OES system is used for monitoring a testing object in the plasma process machine. The APC analysis apparatus is used for analyzing the data received from the OES system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.