System and method for RF shielding of a semiconductor package
US8093691B1 · kind B1 · utility
56Cited by
21References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 14, 2009 |
| Grant date | Jan 10, 2012 |
| Priority date | — |
| Expiry date | Nov 23, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device has a substrate having a plurality of metal traces. At least one electronic component is electrically coupled to a first surface of the substrate. A mold compound is used for encapsulating portions of the electronic component and the first surface of the substrate, wherein a portion of the mold compound is removed around at least one side of the electronic component. A conductive coating is applied to the mold compound and an area where the portion of the mold compound is removed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.