Method of manufacturing non-leaded integrated circuit package system having etched differential height lead structures
US8093694B2 · kind B2 · utility
3Cited by
21References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 10, 2005 |
| Grant date | Jan 10, 2012 |
| Priority date | — |
| Expiry date | Nov 27, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A non-leaded integrated circuits package system is provided including etching differential height lead structures having inner leads at a paddle height, providing mold locks at the bending points of the differential height lead structures, etching an elevated paddle at a same height as the inner leads, mounting a first integrated circuit on the elevated paddle, and electrically connecting first electrical interconnects between the first integrated circuit and the inner leads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.