Flexible semiconductor package and method for fabricating the same
US8097933B2 · kind B2 · utility
2Cited by
3References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 30, 2009 |
| Grant date | Jan 17, 2012 |
| Priority date | — |
| Expiry date | Oct 22, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01047
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A flexible semiconductor package includes a flexible substrate. A data chip is disposed over the flexible substrate. The data chip includes a data storage unit for storing data and first bonding pads that are electrically connected to the data storage unit. A control chip is disposed over the flexible substrate. The control chip includes a data processing unit for processing the data in the data chip and second bonding pads that are electrically connected to the data processing unit. Wirings are formed in order to electrically connect the first bonding pads to the second bonding pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.