Min Suk Suh
31Patents
8h-index
11Co-inventors
68Inventor score
Filing activity: Apr 3, 2001 → Sep 25, 2012
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7525186B2 | Stack package having guard ring which insulates through-via interconnection plug and method for manufacturing the same | Electricity | 240 | Active |
| US7598617B2 | Stack package utilizing through vias and re-distribution lines | Electricity | 43 | Active |
| US7795139B2 | Method for manufacturing semiconductor package | Electricity | 32 | Active |
| US7859115B2 | Semiconductor package for improving characteristics for transmitting signals and power | Electricity | 19 | Active |
| US8299592B2 | Cube semiconductor package composed of a plurality of stacked together and interconnected semiconductor chip modules | Electricity | 16 | Active |
| US7507637B2 | Method of manufacturing wafer level stack package | Electricity | 10 | Active |
| US8159065B2 | Semiconductor package having an internal cooling system | Electricity | 9 | Active |
| US8232654B2 | Semiconductor package through-electrode suitable for a stacked semiconductor package and semiconductor package having the same | Electricity | 8 | Active |
| US8018043B2 | Semiconductor package having side walls and method for manufacturing the same | Electricity | 8 | Active |
| US8319327B2 | Semiconductor package with stacked chips and method for manufacturing the same | Electricity | 6 | Active |
| US7446405B2 | Wafer level chip scale package (WLCSP) with high reliability against thermal stress | Electricity | 5 | Active |
| US7871925B2 | Stack package and method for manufacturing the same | Electricity | 5 | Active |
| US6574052B2 | Optical pick-up actuator | Physics | 4 | Expired |
| US7973414B2 | Semiconductor package through-electrode suitable for a stacked semiconductor package and semiconductor package having the same | Electricity | 4 | Active |
| US7834463B2 | Stack package having pattern die redistribution | Electricity | 4 | Active |
| US7911065B2 | Semiconductor package having a stacked wafer level package and method for fabricating the same | Electricity | 3 | Active |
| US6714364B2 | Optical pick-up actuator | Physics | 3 | Expired |
| US8358016B2 | Semiconductor package having an internal cooling system | Electricity | 3 | Active |
| US6801483B2 | Optical pickup actuator performable tilting operation | Physics | 3 | Expired |
| US8097933B2 | Flexible semiconductor package and method for fabricating the same | Electricity | 2 | Active |
| US8847377B2 | Stacked wafer level package having a reduced size | Electricity | 2 | Active |
| US8203217B2 | Semiconductor package having a stacked wafer level package and method for fabricating the same | Electricity | 2 | Active |
| US8395245B2 | Semiconductor package module | Electricity | 2 | Active |
| US8049341B2 | Semiconductor package and method for manufacturing the same | Electricity | 1 | Active |
| US8202762B2 | Stack package having reduced electrical connection length suitable for high speed operations and method of manufacturing the same | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.