Wafer edge cleaning
US8099817B2 · kind B2 · utility
0Cited by
12References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 7, 2011 |
| Grant date | Jan 24, 2012 |
| Priority date | — |
| Expiry date | Mar 7, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/136
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
In a first aspect, an apparatus for cleaning a thin disk is provided. The apparatus includes a support roller for supporting a rotating wafer within a wafer cleaner. The support roller comprises a guide portion, for receiving an edge of a wafer, having an inclined surface comprising a low-friction material and adapted to allow the wafer edge to slide thereagainst; and an edge-trap portion for retaining the edge of the wafer and having a transverse surface comprising a high-friction material and adapted, when in communication with the edge of the wafer, to resist sliding thereagainst. Numerous other aspects are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.