Dicing method, method of inspecting integrated circuit element, substrate holding device, and pressure sensitive adhesive film
US8101436B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 27, 2003 |
| Grant date | Jan 24, 2012 |
| Priority date | — |
| Expiry date | Aug 8, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68327
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A dicing method, integrated circuit chip testing method, substrate holding apparatus, and adhesive film are disclosed. A first adhesive film 22 in which the adhesion is reduced by ultraviolet radiation is stretched inside a ring-like frame 21 larger than a wafer size, and a wafer W is adhered on the first adhesion film 22. A second adhesive film 4 in which the adhesion of the two surfaces is reduced by heating is adhered on a plate-like jig 3. After the first film is adhered on the second film, dicing is performed. Since the wafer is adhered to the jig, the relative positions of chips do not shift from each other. This makes it possible to load the wafer together with the jig into a testing apparatus and align electrode pads of the chips with a probe. This allows, e.g., collective testing of a plurality of chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.