Patent · US Active

Integrated circuit package system with die and package combination

US8102040B2 · kind B2 · utility

6Cited by
24References
17Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 20, 2009
Grant dateJan 24, 2012
Priority date—
Expiry dateAug 20, 2029

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/3025
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

An integrated package system with die and package combination includes forming a leadframe having internal leads and external leads, encapsulating a first integrated circuit on the leadframe, and encapsulating a second integrated circuit over the first integrated circuit.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.