Optionally bonding either two sides or more sides of integrated circuits
US8102062B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2007 |
| Grant date | Jan 24, 2012 |
| Priority date | — |
| Expiry date | Dec 26, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods and systems for forming a variety of integrated circuits, having quite different interfaces and packages, from a single manufactured die. Preferably the die has bond pads for at least a first mode of operation positioned along only two of its four sides, and these bond pads are sufficient to construct a multi-chip module in which the die is functional in the first mode of operation. Many of the pads on these two sides are duplicated on third and/or fourth sides, except that power management circuitry prevents wasteful capacitive current onto whichever of the duplicated pads is not connected out. Optionally the third and/or fourth sides can be used for connections needed for a mode which is not available with two sides only.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.