Plasma fluid modeling with transient to stochastic transformation
US8103492B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 9, 2008 |
| Grant date | Jan 24, 2012 |
| Priority date | — |
| Expiry date | May 24, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2119/06
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The invention relates to the simulation method and apparatus used in plasma modeling. It includes a method to transform transient formulations of the phenomenological plasma model into a quasi-stochastic spatial formulation. Specifically, the invention aids in decreasing computational time for the modeling of plasma in a plasma processing system, particularly those involving two different time-based parameters. The invention is particularly described in connection with plasma simulations used for the optimization dual-frequency capacitively-coupled plasma etching systems.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.