Patent · US Active

Method and apparatus for thermal analysis

US8104006B2 · kind B2 · utility

12Cited by

5References

29Claims

0Family size

Assignee

Cadence Design Systems, Inc. · US

Inventors

Vinod Kariat · Sunnyvale, US
Igor Keller · Pleasanton, US
Eddy Pramono · Santa Clara, US

Key dates

Filing date	Jan 31, 2008
Grant date	Jan 24, 2012
Priority date	—
Expiry date	Mar 11, 2029

Classification

Technology area (CPC G)Physics
CPC primaryG06F2119/06
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

Some embodiments of the invention provide a method for performing thermal analysis of an integrated circuit (“IC”) layout that includes numerous circuit modules. In some embodiments, the method initially defines several power dissipation equations that express the temperature dependence of the power dissipation for several circuit modules. In some embodiments, the power dissipation equations express a non-linear relationship between power dissipation and temperature. The method defines a heat flow equation based on the specified power dissipation equations. The method then solves the heat flow equation to identify a temperature distribution for the design layout.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.