Single side workpiece processing
US8104488B2 · kind B2 · utility
8Cited by
38References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 24, 2007 |
| Grant date | Jan 31, 2012 |
| Priority date | — |
| Expiry date | Apr 22, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68792
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A centrifugal workpiece processor for processing semiconductor wafers and similar workpieces includes a head which holds and spins the workpiece. The head includes a rotor having a gas system. Gas or air is sprayed or jetted from inlets in the rotor to create a rotational gas flow. The rotational gas flow causes pressure conditions which hold the edges of a first side of the workpiece against an angled annular surface on the rotor. The rotor and the workpiece rotate together. Guide pins adjacent to a perimeter may help to align the workpiece with the rotor. Outlets through the rotor allow gas to flow out of the rotor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.