Patent · US Active

Method for connecting a component with a substrate

US8104667B2 · kind B2 · utility

1Cited by

6References

20Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Karsten Guth · Soest, DE
Aldred Kemper · Warstein, DE
Roland Speckels · Kamen, DE

Key dates

Filing date	Jul 27, 2010
Grant date	Jan 31, 2012
Priority date	—
Expiry date	Aug 5, 2030

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/12493
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

An apparatus for connecting a component with a substrate by means of diffusion soldering in a closed evacuated chamber, wherein the component and the substrate to be connected are displaceable separate from one another in the chamber, and the chamber comprises a combined transfer and pressing unit being displaceable between a current position of the component and a current position of the substrate, for placing and pressing the component on the substrate, and the combined transfer and pressing unit comprises a rotatable element, which, in response to the placing and pressing of the component on the substrate, assumes an angle between the normal of a lower side of the component to be connected and a pressing direction of the component, the angle corresponding to an angle between the normal of a surface area of the substrate to be connected and the pressing direction of the component.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.