Processing apparatus and heater unit
US8106335B2 · kind B2 · utility
2Cited by
3References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 1, 2005 |
| Grant date | Jan 31, 2012 |
| Priority date | — |
| Expiry date | Feb 5, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B3/143
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A processing apparatus has a placement stage that prevents generation of a crack due to heating of an embedded heater. The placement stage (32A) on which a wafer (W) is placed has a plurality of areas (32Aa, 32Ab) so that one of the plurality of heaters is embedded independently in each of the plurality of areas. The heater (35Aa) embedded in one area (32Aa) of adjacent areas has a part (35Aa2) extending in the other area (32Ab) of the adjacent areas, and the heater (35Ab) embedded in the other area (32Ab) of the adjacent areas has a part (35Ab2) extending in the one area (32Aa).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.