Patent · US Active

Semiconductor module having a semiconductor chip stack and method

US8106497B2 · kind B2 · utility

20Cited by

9References

17Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Markus Brunnbauer · Lappersdorf, DE
Markus Fink · Monsheim, DE
Hans-Gerd Jetten · Grevesmühlen, DE

Key dates

Filing date	Jan 12, 2007
Grant date	Jan 31, 2012
Priority date	—
Expiry date	May 20, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/15311
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor module having a semiconductor chip stack and a method for producing the same is disclosed. In one embodiment, a thermally conductive layer with anisotropically thermally conductive particles is arranged between the semiconductor chips. The anisotropically thermally conductive particles have a lower thermal conductivity in a direction vertically with respect to the layer or the film than in a direction of the layer or the film.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.