Patent · US Active

Semiconductor device including isolation layer

US8110906B2 · kind B2 · utility

2Cited by

16References

14Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Joachim Mahler · Regensburg, DE
Wae Chet Yong · Melaka City, MY
Stanley Job Doraisamy · Kuala Lumpur, MY
Gerhard Deml · Munich, DE
Rupert Fischer · Maxhütte-Haidhof, DE
Reimund Engl · Munich, DE

Key dates

Filing date	Jul 16, 2007
Grant date	Feb 7, 2012
Priority date	—
Expiry date	Jun 5, 2029

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/14
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor device includes a carrier, a semiconductor chip including an active area on a first face and a separate isolation layer applied to a second face, and an adhesion material coupling the isolation layer to the carrier with the second face facing the carrier.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.