Semiconductor package structures having liquid coolers integrated with first level chip package modules
US8115303B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 13, 2008 |
| Grant date | Feb 14, 2012 |
| Priority date | — |
| Expiry date | May 18, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Semiconductor package structures are provided which are designed to have liquid coolers integrally packaged with first level chip modules. In particular, apparatus for integrally packaging a liquid cooler device within a first level chip package structure include structures in which a liquid cooler device is thermally coupled directly to the back side of an integrated circuit chip flip-chip mounted on flexible chip carrier substrate. The liquid cooler device is mechanically coupled to the package substrate through a metallic stiffener structure that is bonded to the flexible package substrate to provide mechanical rigidity to the flexible package substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.