Negative coefficient of thermal expansion particles
US8119206B2 · kind B2 · utility
3Cited by
11References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 7, 2009 |
| Grant date | Feb 21, 2012 |
| Priority date | — |
| Expiry date | Sep 25, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31609
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of forming a negative coefficient of thermal expansion particle includes flattening a hollow sphere made of a first material, annealing the flattened hollow sphere at a reference temperature above a predetermined maximum use temperature to set a stress minimum of the flattened hollow sphere, and forming a coating made of a second material on the flattened hollow sphere at the reference temperature, the second material having a lower coefficient of thermal expansion than that of the first material, the negative coefficient of thermal expansion particle characterized by volumetric contraction when heated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.