Michael J. Rooks
22Patents
6h-index
47Co-inventors
65Inventor score
Filing activity: Apr 15, 1999 → Jul 20, 2012
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8008095B2 | Methods for fabricating contacts to pillar structures in integrated circuits | Electricity | 56 | Active |
| US8399314B2 | p-FET with a strained nanowire channel and embedded SiGe source and drain stressors | Electricity | 35 | Active |
| US8445892B2 | p-FET with a strained nanowire channel and embedded SiGe source and drain stressors | Electricity | 25 | Active |
| US7999251B2 | Nanowire MOSFET with doped epitaxial contacts for source and drain | Electricity | 16 | Active |
| US7417315B2 | Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging | Emerging Cross-Sectional Technologies | 9 | Expired |
| US6280908A | Post-development resist hardening by vapor silylation | Physics | 8 | Expired |
| US7037638B1 | High sensitivity crosslinkable photoresist composition, based on soluble, film forming dendrimeric calix[4] arene compositions method and for use thereof | Physics | 6 | Expired |
| US7160477B2 | Method for making a contact magnetic transfer template | Emerging Cross-Sectional Technologies | 6 | Expired |
| US8754530B2 | Self-aligned borderless contacts for high density electronic and memory device integration | Electricity | 3 | Active |
| US8119206B2 | Negative coefficient of thermal expansion particles | Emerging Cross-Sectional Technologies | 3 | Active |
| US6821715B2 | Fully undercut resist systems using E-beam lithography for the fabrication of high resolution MR sensors | Emerging Cross-Sectional Technologies | 2 | Expired |
| US8241957B2 | Negative thermal expansion system (NTES) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging | Emerging Cross-Sectional Technologies | 2 | Active |
| US8153494B2 | Nanowire MOSFET with doped epitaxial contacts for source and drain | Electricity | 2 | Active |
| US7696057B2 | Method for co-alignment of mixed optical and electron beam lithographic fabrication levels | Electricity | 1 | Active |
| US7525109B2 | Method for writing a large-area closed curvilinear pattern with a cartesian electron beam writing system | Electricity | 1 | Active |
| US7572499B2 | Contact magnetic transfer template | Emerging Cross-Sectional Technologies | 1 | Expired |
| US7579069B2 | Negative coefficient of thermal expansion particles and method of forming the same | Emerging Cross-Sectional Technologies | 1 | Active |
| US7556979B2 | Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging | Emerging Cross-Sectional Technologies | 1 | Active |
| US8120138B2 | High-Z structure and method for co-alignment of mixed optical and electron beam lithographic fabrication levels | Electricity | 0 | Active |
| US6440639B1 | High-aspect ratio resist development using safe-solvent mixtures of alcohol and water | Physics | 0 | Expired |
| US7550361B2 | Trench structure and method for co-alignment of mixed optical and electron beam lithographic fabrication levels | Electricity | 0 | Active |
| US7883919B2 | Negative thermal expansion system (NTEs) device for TCE compensation in elastomer compsites and conductive elastomer interconnects in microelectronic packaging | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.