Substrate processing method and substrate processing apparatus
US8124168B2 · kind B2 · utility
1Cited by
5References
7Claims
0Family size
Assignee
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Key dates
| Filing date | Apr 4, 2006 |
| Grant date | Feb 28, 2012 |
| Priority date | — |
| Expiry date | Apr 6, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/10
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Disclosed is a substrate processing method wherein the infrared absorptance or infrared transmittance of a substrate to be processed is measured in advance, and the substrate is processed according to the measured value while independently controlling temperatures at least in a first region located in the central part of the substrate and in a second region around the first region using temperature control means which are respectively provided for the first region and the second region and can be controlled independently from each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.