Patent · US Active

Device including a semiconductor chip and metal foils

US8124449B2 · kind B2 · utility

2Cited by

3References

23Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Georg Meyer-Berg · Birkenfeld, DE
Andreas Schloegl · Ottobrunn, DE

Key dates

Filing date	Dec 2, 2008
Grant date	Feb 28, 2012
Priority date	—
Expiry date	May 24, 2030

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A device including a semiconductor chip and metal foils. One embodiment provides a device including a semiconductor chip having a first electrode on a first face and a second electrode on a second face opposite to the first face. A first metal foil is attached to the first electrode of the semiconductor chip in an electrically conductive manner. A second metal foil is attached to the second electrode of the semiconductor chip in an electrically conductive manner.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.