Integrated circuit packaging system with interposer
US8124451B2 · kind B2 · utility
2Cited by
19References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 21, 2007 |
| Grant date | Feb 28, 2012 |
| Priority date | — |
| Expiry date | Oct 1, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit packaging system comprising: fabricating an interposer array having an access opening; fabricating a base package substrate sheet; attaching a first integrated circuit die over the base package substrate sheet; mounting the interposer array over the first integrated circuit die; and singulating a base package from the base package substrate sheet and the interposer array by cutting the access opening generally through the center.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.