Method of manufacturing an integrated circuit module

US8129225B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Stefan Landau · Usingen, DE
• Alexander Koenigsberger · Regensburg, DE
• Joachim Mahler · Regensburg, DE
• Klaus Schiess · Allensbach, DE

Key dates

• Filing date: Aug 10, 2007
• Grant date: Mar 6, 2012
• Expiry date: Jun 4, 2029

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/181
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method includes providing an integral array of first carriers, arranging first semiconductor chips on the first carriers, and arranging an integral array of second carriers over the semiconductor chips.