Wire bond interconnection and method of manufacture thereof
US8129263B2 · kind B2 · utility
1Cited by
49References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 7, 2011 |
| Grant date | Mar 6, 2012 |
| Priority date | — |
| Expiry date | Jul 7, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1517
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacture of a semiconductor package includes: providing a substrate; mounting a semiconductor die on the substrate, the semiconductor die having a die pad; mounting a lead finger on the substrate; attaching a support pedestal on sides of the lead finger; and attaching a wire interconnection between the die pad and the support pedestal, the wire interconnection having a ball bond on the die pad and a stitch bond on the support pedestal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.