Semiconductor chip assembly with post/base heat spreader and plated through-hole
US8129742B2 · kind B2 · utility
13Cited by
41References
60Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 2, 2011 |
| Grant date | Mar 6, 2012 |
| Priority date | — |
| Expiry date | Apr 2, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8582
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a post and a base. The conductive trace includes a pad, a terminal and a plated through-hole. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The post extends upwardly from the base into an opening in the adhesive, and the base extends laterally from the post. The conductive trace provides signal routing between the pad and the terminal using the plated through-hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.