Shielding for a semiconductor package
US8129824B1 · kind B1 · utility
33Cited by
23References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 3, 2008 |
| Grant date | Mar 6, 2012 |
| Priority date | — |
| Expiry date | Jun 26, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device has a substrate. A first die is electrically attached to a first surface of the substrate. A shield spacer having a first and second surface is provided wherein the second surface of the shield spacer is attached to a first surface of the first die. A plurality of wirebonds are attached to the shield spacer and to the substrate. A mold compound is provided for encapsulating the first die, the shield spacer, and the wirebonds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.