Lee Smith
14Patents
11h-index
27Co-inventors
72Inventor score
Filing activity: Dec 4, 1991 → Oct 18, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7176506B2 | High frequency chip packages with connecting elements | Emerging Cross-Sectional Technologies | 238 | Expired |
| US7842541B1 | Ultra thin package and fabrication method | Electricity | 148 | Active |
| US6472758B1 | Semiconductor package including stacked semiconductor dies and bond wires | Emerging Cross-Sectional Technologies | 105 | Expired |
| US6650019B2 | Method of making a semiconductor package including stacked semiconductor dies | Emerging Cross-Sectional Technologies | 71 | Expired |
| US7268426B2 | High-frequency chip packages | Emerging Cross-Sectional Technologies | 37 | Expired |
| US8129824B1 | Shielding for a semiconductor package | Electricity | 33 | Active |
| US8017436B1 | Thin substrate fabrication method and structure | Electricity | 24 | Active |
| US7687893B2 | Semiconductor package having leadframe with exposed anchor pads | Electricity | 20 | Active |
| USD426641S | Body shaping device | General | 17 | Expired |
| USD483628S1 | Food dicing device | General | 15 | Expired |
| US5216922A | Slope monitoring device | Physics | 11 | Expired |
| US9367712B1 | High density memory card using folded flex | Physics | 1 | Active |
| US8089141B1 | Semiconductor package having leadframe with exposed anchor pads | Electricity | 1 | Active |
| US11840103B2 | Tapeless carrier for mechanically fixing tube-shaped objects | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.